The battle in the high-end mobile processor chip segment has never shown signs of cooling down in recent years. Apple is leading the market with A-series chip models with outstanding performance, but pursuers such as Qualcomm (Snapdragon), Samsung (Exynos) or MediaTek (Dimensity) … also always show that they can break through. up at any time.
MediaTek has just proven the above statement to be completely valid when it launched a “steel fist” called Dimensity 9000. This is the world’s first commercial mobile CPU model developed on the advanced 4nm process, going along with a series of outstanding improvements compared to the predecessor product line Dimensity 1200 which has also been evaluated very positively.
The Dimensity 9000 has a “triple cluster” CPU architecture, which is similar to what Qualcomm has been doing for the past few years. However, the difference is that MediaTek’s flagship chip will not only support the new ARMv9 architecture, but also contain high-performance Cortex-X2 cores. The specifics are as follows:
- 1 Cortex-X2 core running at 3.05GHz
- 3 Cortex-A710 cores running at 2.85GHz
- 4 Cortex-A510 cores running at 1.80GHz
In addition, Dimensity 9000 will also own up to 8MB of L3 cache and 6MB of system cache. MediaTek confidently claims that its flagship SoC model can deliver 35% faster performance and 37% more power efficiency than the processor chip found on many current generation high-end Android smartphones. The new silicon chip also supports LPDDR5X memory which is faster and consumes less power, and can reach speeds of up to 7500Mbps. With Samsung officially announcing the LPDDR5X RAM chip for smartphones, smartphone makers will now have the option of using both Dimensity 9000 and faster RAM in their 2022 flagship products. me.
Taking on the graphics processing power on the Dimensity 9000 is the ARM-Mali G710 GPU. With a total of 10 cores, this new integrated graphics processor also supports mobile ray tracing and FHD panels with a refresh rate of up to 180Hz. The Dimensity 9000 can also handle up to a 320MP camera thanks to its 18-bit HDR-enabled image signal processor. The chipset also supports a 3 main camera solution with 32MP resolution, with all 3 sensors capable of recording HDR video, while consuming less power.
In terms of other notable features, the Dimensity 9000 is equipped with MediaTek’s 5th generation APU, which is 4 times more energy efficient and at the same time 4 times more powerful than previous generation technology. In terms of connectivity, the new chip has an integrated M80 5G modem and supports the new 3GPP R16 5G standards, and supports 7Gbps downlink speeds. Connectivity technologies supported by the Dimensity 9000 include Bluetooth 5.3, Wi-Fi 6E 2×2 MIMO, Bluetooth LEAudio and Beidou III-B1C GNSS.
A recent series of rumors from many reputable sources suggest that the US semiconductor giant, Qualcomm, will launch the next-generation flagship chip, the Snapdragon 895 SoC, in early December this year. This chip will be developed based on the 4nm process with powerful performance and excellent power saving. As such, it is not difficult to see that the upcoming 4nm MediaTek Dimensity processor and Snapdragon 895 will compete head-to-head in all aspects, as the world’s first 4nm processors. Confrontation history shows that Qualcomm is always the winner, but the progress that MediaTek has made recently cannot be underestimated.
Currently, Dimensity 1200 is MediaTek’s top-level mobile processor, also made by TSMC. This chip is based on 6nm EUV technology process, and is considered as a reasonable replacement for Qualcomm Snapdragon 888 on more affordable flagship smartphone models. However, with the launch of the new 4nm Dimensity chip, MediaTek certainly wants to compete more fairly with Qualcomm.